Category: Computer/Internet, e-Discovery, Legal Technology, Resources for Attorneys Helpful e-Discovery Tips TASA ID: 4285 Throughout the years I have been asked my advice on what to do and what not to do when it comes to e-Discovery matters. It was only recently on social media that I decided to post some of the advice that I had given out to many. By no means is this an extensive list; however, these tips will help with general inquiries you may have, especially when it comes to cases. Read more
Category: Computer/Internet, e-Discovery, Legal Technology, Resources for Attorneys Using e-Discovery Technology to Avoid Inadvertent Disclosure TASA ID: 4285 There have been many articles written on the topic of inadvertent disclosure of privileged information in litigation, but in Legal Support Partners (LSP) and TASA’s practice of providing e-Discovery services, there are still mistakes being made in how technology is used (or not) in the identification of privileged documents in electronically stored information (ESI). For this reason, it might be helpful to describe some of the e-Discovery tools that can be leveraged to identify privileged communication within a company’s ESI collection to reduce the risk of inadvertent disclosure . . . Read more
Category: Manufacturing New Trends in Wire Bond Packaging TASA ID: 4595 As new high-speed products with ever-increasing capabilities are developed and introduced into the market, new advanced IC packaging designs and methods also must be developed to meet these new products’ requirements. New advanced packages are being designed to maximize I/O numbers, minimize wire bond loop length, and provide System-In-Package (SiP) performance. Stacked die packages, providing (SiP) performance, are already the mainstream of cellular phone manufacturing. Wire bonded Lead-On-Chip (LOC, FBGA) packages are the largest production volume portion of the DDR I memory market, and will be the dominant package type through the DDR II generation1. Read more
Category: Manufacturing Should We Pull Test and Shear Test Fine-Pitch Wedge and Ribbon Bonds? TASA ID: 4595 The wire bond pull test and shear test are widely used to evaluate and control the quality of ball bonds—fine pitch and otherwise. The shear test is the only method that adequately evaluates the strength of the weld. The pull test cannot test the weld because the welded cross section is normally significantly larger and stronger than that of the wire. Read more
Category: Manufacturing Very Fine Pitch Wire Bonding: Re-Examining Wire, Bonding Tool and Wire Bonder Interrelationships for Optimum Process Capability TASA ID: 4595 Through continuous improvements, wire bonding remains the dominant interconnection method. The demand to reduce die size and increase functionality (conserving valuable silicon real estate and increasing the number of interconnects) continues. This has accelerated a decrease in the pitch and size of interconnects. Today’s leading edge production devices are gold ball bonded with 60 mm (bond pad) pitch and wedge bonded with 50 mm pitch. In the near future, gold ball bonding will approach 40 mm pitch and wedge bonding will approach 30 mm. As the pitch and size of the interconnections (bond pads) have decreased, the interrelationship of the various process inputs on each other has increased. Read more
